| 摘要 |
<p>PROBLEM TO BE SOLVED: To obtain an apparatus for pushing up a semiconductor chip on a dicing sheet by means of a push-up pin while protecting the rear surface of semiconductor chip against damage. SOLUTION: A contact detector 41i detects the contact of a push-up pin 41h with a dicing sheet, for example. When the contact is detected, a pump 41f is driven through a controller 41j. A negative pressure is brought about in a backup holder 41c by a specified vacuum force of the pump 41f and a sheet 101 is secured onto the upper surface of holder 41c. Since the vacuum operation of pump 41f is started upon contact of push-up pin 41h with dicing sheet, a semiconductor chip 100a is protected against application of an undue force at the time of push-up.</p> |
