LIQUID CRYSTAL DISPLAY DEVICE

摘要

PROBLEM TO BE SOLVED: To lessen the inclination and deviation at the time of packaging of a driving IC occurring in the nonuniformity of a bump wiring density and to improve reliability by providing this driving IC with dummy bumps not participating in electrical connection. SOLUTION: The electrical connection and mechanical supporting of the driving IC are executed by the input bump IB and output bump OB disposed at the outer edge of the rear surface of the driving IC. The bumps are designed and arranged from only the convenience of the electrical connection and the total area difference of the bumps on the side to be paired or the variation in the arrangement of the bumps within the same side is large and the pressure acting on the bumps at the time of thermally press bonding the driving IC to the input terminals IT and output terminals OT disposed on the surface of the transparent glass substrate is made nonuniform, by which the occurrence of the inclination and mispositioning of the driving IC is resulted. The driving IC is provided with the dummy bumps DB not participating in the electrical connection at the points where the dump density is dense. As a result, the total area difference of the bumps from the sides to be paired is corrected and the pressure difference acting on the bumps at the time of thermocompression bonding is relieved.