发明名称 SILICON NITRIDE HEAT SINK FOR COMPRESSION AND COMPRESSION STRUCTURE PARTS USING IT
摘要 PROBLEM TO BE SOLVED: To provide a silicon nitride heat sink where high-strength characteristics which silicon nitride sinter originally has are utilized and which has a high thermal conductivity, an improved cooling property, and at the same time a drastically improved insulation breakdown characteristic and a compression structure part utilizing it. SOLUTION: A silicon nitride heat sink 7a for compression contains 2.0-17.5wt.% rare earth elements being converted to an oxide and a total of 0.3wt.% or less Li, Na, K, Fe, Ca, Mg, Sr, Ba, Mn, and B as an impurity cation element and is made of a high-thermal conduction silicon nitride sinter with a thermal conductivity of 90W/m.K or higher. Also, a compression structure part such as thyristor is constituted by compressing such an electrical heating element as a rectification element 10 to a silicon nitride heat sink 7a made of the silicon nitride sinter with a thermal conductivity of 90W/m.K or higher.
申请公布号 JPH0969594(A) 申请公布日期 1997.03.11
申请号 JP19950344234 申请日期 1995.12.28
申请人 TOSHIBA CORP 发明人 IKEDA KAZUO;KOMATSU MICHIYASU;MIZUNOYA NOBUYUKI;SATOU YOSHITOSHI
分类号 H05K7/20;C04B35/584;H01L23/373;H02M1/06 主分类号 H05K7/20
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