INTERLAYER INSULATION ADHESIVE FOR MULTILAYERED PRINTED CIRCUIT BOARD

摘要

PROBLEM TO BE SOLVED: To obtain an interlayer insulation adhesive for multilayered printed circuit boards which is excellent in storage stability. SOLUTION: This adhesive contains as the essential components a bisphenol epoxy resin having a wt. average mol.wt. of 10,000 or higher, a bisphenol epoxy resin having an epoxy equivalent of 500 or lower, and an imidazole compd. having an m.p. of 130 deg.C or higher and insol. or hardly sol. in an epoxy resin at normal temp.