发明名称 FORMING METHOD OF CERAMIC SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To obtain a thin ceramic substrate by spraying a release powder in a recessed part of a lower punching jig, supplying a ceramic powder and pressing with an upper punch, and repeating these processes to form a specified ceramic laminated formed body, and then sintering. SOLUTION: A ceramic source material compounded to obtain a specified compsn. is calcined and then pulverized to prepare a powder material having about 10-100μm average particle size. Then, a release powder such as a sheeting powder having about 1-5μm average particle size is sprayed to about 1-10μm thickness in a specified recess of specified depth in a lower punching jig. Then the ceramic source material powder is supplied by a specified amt., and an upper punching jig is fitted and pressed under specified pressure. This procedure is repeated so that pressed release powder layers and pressed ceramic powder layers are successively deposited on the recessed part of the lower punching jig to obtain an integrated ceramic laminated body by pressure. Then the formed body is sintered at about 1100-1300 deg.C to obtain a sintered body, which is then dipped in water and irradiated with ultrasonic waves to separate and remove the release powder. Thus, a dense and thin ceramic substrate can be obtd.
申请公布号 JPH0967168(A) 申请公布日期 1997.03.11
申请号 JP19950220596 申请日期 1995.08.29
申请人 KYOCERA CORP 发明人 HIROTA MUTSUAKI
分类号 C04B35/64;B28B3/02;B28B11/02 主分类号 C04B35/64
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