发明名称 SEMICONDUCTOR WAFER CLASSIFICATION DEVICE
摘要 PROBLEM TO BE SOLVED: To obtain a wafer classification device which can be lessened in occupation area, operating time, and cost. SOLUTION: A semiconductor wafer classification device is equipped with a loading station 12 which delivers a wafer, a wafer identification device 20 which is equipped with a wafer identification code reading device 40 and a wafer delivery device, and an unloading station 13 which houses the identified wafers at designated positions. The reading device 40 is equipped with a TV camera which picks up the images of a pair of reading areas 47A and 47B. The delivery device is arranged on a reading stage 31 to serve to align an identification code 4 with either of the reading areas 47A and 47B. By this setup, the fed wafer is transferred to the reading stage 31 by the delivery device arranged on it. The delivery device makes an identification code coincident with either of the reading areas 47A and 47B. The reading device 40 reads in an identification code. That is, the delivery device itself serves as an alignment device, so that the semiconductor wafer classification device of this constitution can be lessened in occupation area, operating time, and cost.
申请公布号 JPH0969477(A) 申请公布日期 1997.03.11
申请号 JP19950245392 申请日期 1995.08.30
申请人 HITACHI LTD;HITACHI TOKYO ELECTRON CO LTD 发明人 NAGAI HARUO;YAMATANI KAZUHIRO;IIZUKA HARUO;MATSUOKA KAZUHIKO
分类号 G06K9/20;H01L21/02;H01L21/677;H01L21/68;(IPC1-7):H01L21/02 主分类号 G06K9/20
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