发明名称 Integrated circuit module fixing method for temperature cycling test
摘要 An apparatus to retain integrated circuit modules during the preparation for a cycling of temperature, during the cycling of temperature, and during the post-handling after the cycling of temperature, is described. The apparatus has a specimen basket to contain the integrated circuit modules, a plurality of specimen retaining rods coupled to the specimen basket to prevent the integrated circuit modules from movement within the basket, a plurality of integrated circuit module retaining means coupled to the specimen retaining rods to secure each of the integrated circuit modules within in the specimen basket, and a specimen securing rod retaining means to fasten each of the specimen retaining rods to the specimen basket.
申请公布号 US5610081(A) 申请公布日期 1997.03.11
申请号 US19960658525 申请日期 1996.06.03
申请人 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD 发明人 PING, KING-HO;LEE, JIN-YUAN
分类号 G01R1/04;G01R31/28;H01L21/673;H05K13/00;(IPC1-7):H01L21/66;B65D73/02;F27D5/00;G01R31/26 主分类号 G01R1/04
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