发明名称 |
Integrated circuit module fixing method for temperature cycling test |
摘要 |
An apparatus to retain integrated circuit modules during the preparation for a cycling of temperature, during the cycling of temperature, and during the post-handling after the cycling of temperature, is described. The apparatus has a specimen basket to contain the integrated circuit modules, a plurality of specimen retaining rods coupled to the specimen basket to prevent the integrated circuit modules from movement within the basket, a plurality of integrated circuit module retaining means coupled to the specimen retaining rods to secure each of the integrated circuit modules within in the specimen basket, and a specimen securing rod retaining means to fasten each of the specimen retaining rods to the specimen basket.
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申请公布号 |
US5610081(A) |
申请公布日期 |
1997.03.11 |
申请号 |
US19960658525 |
申请日期 |
1996.06.03 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD |
发明人 |
PING, KING-HO;LEE, JIN-YUAN |
分类号 |
G01R1/04;G01R31/28;H01L21/673;H05K13/00;(IPC1-7):H01L21/66;B65D73/02;F27D5/00;G01R31/26 |
主分类号 |
G01R1/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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