| 摘要 |
PROBLEM TO BE SOLVED: To obtain a bonding tool being used as a compression tool for mounting a semiconductor element, e.g. an IC or LSI, onto a board in which even an ultrathin lead wire is not broken easily at the time of mounting. SOLUTION: In a bonding tool for mounting a semiconductor element having a forward pressing surface 3 made of a hard material principally comprising diamond or cubic boron nitride, four sides forming the forward pressing surface 3 or a part of ridge 4 is rounded with a radius of 1-100μm.
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