| 摘要 |
PROBLEM TO BE SOLVED: To miniaturize the average area for mounting an acceleration sensor by arranging an integrated circuit for driving a sensor between a circuit board and a sensor enclosure. SOLUTION: An integrated circuit 7 for driving a sensor is arranged between a circuit board 9 and a sensor enclosure. That is, a recessed part 10 is provided at the circuit board 9 and the integrated circuit 7 is die-bonded to connect (bond) a circuit pattern 6 and the integrated circuit 7 with a wire 11. Then, after the integrated circuit 7 is mounted, an acceleration sensor is placed on it and is adhered by a non-conductive adhesive, and the electrode of the acceleration sensor and the circuit pattern 6 are connected by a connection lead 5. Since the circuit pattern 6 is arranged so that it surrounds the integrated circuit 7, its length can be reduced and the gap of the circuit pattern 6 can be increased, thus reducing the capacity due to the circuit pattern 6 and improving the sensitivity of the sensor. |
