| 摘要 |
<p>PROBLEM TO BE SOLVED: To enable excellent wire bonding to an LSI package and the easy mounting of a bare chip onto a printed wiring board. SOLUTION: In a square-shaped frame-shaped semiconductor mounting device 101 having junction pads 102 and 103 for connecting inner leads with the die pads 107 of an LSI chip 106 on a top face, the junction pads 102 and 103 are connected by wiring patterns, the junction pads 102 are arranged at the same places as the die pads of the LSI chips on the inside of the top face of the mounting device 101, and conductive wirings 105 are connected on the junction pads 102 so as to be projected to the inside of the mounting device 101 at angles and in length capable of being connected to the die pads 107 when the mounting device 101 is die-bonded with an LSI package 108. The junction pads 102 and the die pads 107 are joined by mounting the mounting device 101 on the LSI chip beforehand die-bonded to the LSI package from the top face of the LSI chip, and the lead frame 109 of the LSI package and the pads 103 are wire- bonded.</p> |
