发明名称 |
METHOD AND APPARATUS FOR CARRYING CONDUCTIVE BALL |
摘要 |
<p>PROBLEM TO BE SOLVED: To securely mount a conductive ball such as a solder ball on an electrode of a work even when a carrier for holding the work is bent. SOLUTION: A solder ball 6 is vacuum-sucked into a suction hole 28 formed in a lower surface of a carrying head 23. A carrier 12 that holds a work 2 and is carried on a carrying passage is bent so that the work 2 held on the carrier 12 is inclined. The work 2 is resiliently supported on a resilient member 41 disposed in a recess 40 in the carrier 12. Once the carrying head 23 is lowered and hence the solder ball 6 makes contact with an electrode 4 of the work 2, the work 2 compresses the resilient member 41 and is rocked vertically to take a horizontal attitude so that all the solder ball 6 is securely mounted on the electrode 4 of the work 2.</p> |
申请公布号 |
JPH0964151(A) |
申请公布日期 |
1997.03.07 |
申请号 |
JP19950210279 |
申请日期 |
1995.08.18 |
申请人 |
MATSUSHITA ELECTRIC IND CO LTD |
发明人 |
SAKAMI SEIJI |
分类号 |
H01L21/60;H01L21/677;H01L21/683;H05K3/34;(IPC1-7):H01L21/68 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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