CHIP SIZE PACKAGE AND MANUFACTURE THEREOF

摘要

PROBLEM TO BE SOLVED: To reduce the cost and to sufficiently protect an LSI by decreasing the number of steps without using a mold. SOLUTION: Bumps 301 to 308 are formed at the electrodes 201 to 308 of LSIs 101 to 104 formed on a wafer, the peripheries of the bumps are covered with resin, solder balls to be connected to the bumps are formed, and cutting process for the individual LSIs is taken to obtain a chip size package.