| 摘要 |
PROBLEM TO BE SOLVED: To make it possible to supply many semiconductor chips provided on a wafer tray to a work one by one by providing feeding means for feeding the chip supplied by a first transfer collet to a positioning stage at a stock stage. SOLUTION: The second transfer collet so formed as to supply semiconductor chips 12 at a positioning stage 16 to a lead frame 14 in a conveying line 15 by reciprocating is disposed above the stage 16 and the line 15. A stock stage 20 is provided adjacent to the stage 16, and so formed as to supply the picked-up chip 12 by a first transfer collet 17 to one end of the stage 20. On the other hand, feeding means for so sequentially feeding the chips 12 supplied to one end to the stage 16 is provided at the stage 20. |
