PRODUCTION OF MULTILAYERED PRINTED WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To obtain a method for producing a multilayered printed wiring board in which the positional shift between the center of a land formed on an inner layer board and the center of an actually drilled hole is suppressed regardless of fluctuation in the multilayer molding shrinkage. SOLUTION: An inner layer board is scaled using a value higher by 0.01-0.03% than the average shrinkage rate thereof due to multilayer molding. Upon finishing the multilayer molding, the inner layer board is heated at a temperature higher than the glass transition point thereof by 20 deg.C or less without applying any pressure and then it is cooled thus producing a multilayer printed wiring board.