PRODUCTION OF MULTILAYERED CERAMIC WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To produce a ceramic multilayered wiring board excellent in the reliability of connection between the wiring conductor of the outer layer formed by a thin film method and a conductor of via part formed by a thick film method. SOLUTION: The wiring conductor of the outer layer is formed by a thin film method on the surface of a ceramic board where the wiring conductor of the inner layer is formed by a thick film method and integrated. In such a method for producing a ceramic multilayered wiring board, the surface of a ceramic board is roughened using heated phosphoric acid prior to formation of the wiring conductor of the outer layer. In this production method, the temperature of phosphoric acid for roughening the surface of the ceramic board is set in the range of 140-360 deg.C.