| 摘要 |
A mask structure (40) and method for its use which allow for the efficient use of silicon wafers in semiconductor fabrication. In accordance with the present invention, the layout of the individual masks (44, 46, 48, 50) used in the fabrication of circuit dice is modified by re-configuring the operating protocol of the stepper such that the alignment keys and targets are formed in the two subfields (52a, 52f, 54a, 54f, 56a, 56f, 58a, 58f) lying in the upper left and upper right corners, respectively, of each field. Thus, the 200 micrometer wide portion of each field may contain patterns used in the formation of circuit dice rendering this usable space. The operating protocol of the stepper is further modified such that scribe lines separating rows and columns of subfields are less than 100 micrometers wide, thereby reducing the unused or wasted portions of the silicon wafer. |
