Verfahren zur Herstellung einer Verbindung zwischen zumindest zwei elektrischen Leitern, von denen einer auf einem Trägersubstrat angeordnet ist

摘要

Described is a method of establishing a connection between at least one first electrical conductor forming a first joint partner (2) and a second conductor (4) mounted using laminating or etching techniques on a supporting substrate (3) and forming, together with the substrate, a second joint partner. The at least two joint partners (2, 3 and 4) are first brought into contact with each other by a tool (5) to which mechanical energy is supplied, and the substrate (3) is then melted in the vicinity of the tool (5) by also supplying heat. This causes the substrate to give way to the tool (5), and the at least two conductors (2, 4) are thus connected to each other by the tool (5).