| 摘要 |
<p>A method and an apparatus for peeling a protective adhesive tape (3) from a work which is a semiconductor wafer (W) with a protective adhesive tape (3) attached to the semiconductor wafer (W). The work is held on a ring-shaped frame (F) via a support adhesive tape (1). Thin plates (4) having non-adhesive upper surfaces are stuck on the portions of the support adhesive tape (1) which are on the peel-starting and peel-finishing ends (3a, 3b) sides of the protective adhesive tape (3) so as to provide regions where the contact of a peeling tape (5) wound around an attaching roller (8) with the support adhesive tape (1) is avoided. The peeling tape (5) is then stuck on the protective adhesive tape (3) from the peel-starting end with the attaching roller (8), and the rollers (6-8) are moved horizontally on the work (A), whereby the peeling tape (5) and protective adhesive tape (3) are peeled together from the surface of the wafer (W).</p> |
