发明名称 |
Method of manufacturing a substrate for microwave integrated circuits |
摘要 |
A microwave integrated circuit formed on a substrate (22) comprising a body of insulating material having upper and lower surfaces with one or more holes (21) formed in said body to extend between the upper and lower surface and a metal filling said holes and extending between and coplanar with the upper and lower surfaces. |
申请公布号 |
EP0362161(B1) |
申请公布日期 |
1997.03.05 |
申请号 |
EP19890830421 |
申请日期 |
1989.09.26 |
申请人 |
MICROWAVE POWER, INC. |
发明人 |
BUJATTI, MARINA;SECHI, FRANCO NICOLA |
分类号 |
H05K1/11;H01L23/498;H01L23/66;H05K1/02;H05K1/03;H05K3/20;H05K3/40;H05K3/42 |
主分类号 |
H05K1/11 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|