Multi-chip-module

摘要

The multi-chip module comprises a substrate (21) of monocrystalline silicon, whose surface is enlarged, at least in part, by anodic, electrochemical etching in a fluoride-containing acidic electrolyte. Arranged on the enlarged surface of the substrate (21) there is at least one capacitor (23) which comprises a dielectric layer and a conductive layer, the substrate (21) and the conductive layer acting as capacitor electrodes.