Semiconductor device and method of assembling the same

摘要

In a semiconductor device (100), a semiconductor element (2) is stored in a casing while being held by external electrodes (51,61) through first and second electrodes. The outer peripheral edge of the first electrode plate (51) is projected outwardly beyond that of the semiconductor element (2) and a ring-shaped groove (51a) is provided in the first surface of the first electrode plate along the outer peripheral edge of the semiconductor element such that a line, which is projected from the outer peripheral edge of the semiconductor element on the first surface of the first electrode plate, is located on the ring-shaped groove portion. An adhesive holding member (41) is charged in the groove and the outer peripheral portion of the semiconductor element. Thus, the semiconductor element (2) is fixed to the first electrode plate (51) in a state being protected by the adhesive holding member (41) covering its end portion.