SEALING APPARATUS OF SEMICONDUCTOR PROCESS CHAMBER

摘要

There is provided a sealing apparatus of a process chamber for manufacturing a semiconductor device. The sealing device includes: a base plate(2) in which a stepped portion is formed; an O-ring(4) which is disposed on the stepped portion of the base plate(2); a process chamber(6) which is disposed at a side of the O-ring(4) on the stepped portion of the base plate(2); and a pushing plate(8) in which a stepped portion is formed on an end thereof, and the end of the stepped portion is placed on the process chamber, thereby preventing a crack and a break of the process chamber(6).