发明名称 AUTOMATED THERMOSET MOLDING METHOD AND APPARATUS.
摘要 An automated transfer/injection molding apparatus and process is defined that includes a charge forming unit, a shuttle unit, and a molding unit. The charge is formed from one or more slabs of reinforthe charge is preheated in the charge shuttle unit and is delivered to the molding unit, whereupon the preheated charges are forced by the pressure of a movable platform under vacuum into a mold cavity for polimerization. The fibers within the slabs are randomly oriented in parallel to the direction of initial flow into the cavity.
申请公布号 MX9602956(A) 申请公布日期 1997.02.28
申请号 MX19960002956 申请日期 1996.07.24
申请人 THE BUDD COMPANY 发明人 JACK J. RITCHIE;RICHARD BENJAMIN FREEMAN;TERRY L. INGHAM;JOHN J. MORSE;JOSEPH A. BODARY
分类号 B29C31/08;B29C33/00;B29C43/02;B29C43/20;B29C43/34;B29C43/36;B29C43/42;B29C43/56;B29C45/00;B29C45/02;B29C45/26;B29C45/76;B29C70/46;B29K101/10;B29K105/12;(IPC1-7):B29C51/00 主分类号 B29C31/08
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