| 摘要 |
<p>A method of hermetically encapsulating a crystal oscillator (100) using a thermoplastic shell. First, a thermoplastic shell defining a cavity is molded around a periphery of oscillator locations on a lead frame (102). Second, oscillator components including a piezoelectric element, capacitors and an integrated circuit are attached to the lead frame (104). Third, an encapsulant is dispensed within the cavity defined by the thermoplastic shell to encapsulate the oscillator components (106). Fourth, the encapsulant is cured (108). Thereafter, the oscillator is singulated from the lead frame and the leads are formed for mounting (110).</p> |
