| 摘要 |
The present invention relates to a probe card for testing the failure of a semiconductor IC chip. The probe card according to the present invention comprises a vertical needle module having an upper fixing plate and a lower fixing plate through which vertical-type needles are attached; a mass ring attached to said vertical needle module for smooth contact of said vertical-type needles with pads of a semiconductor IC chip; a guide ring for smooth movement of said mass ring and said vertical needle module and for protecting said mass ring and said vertical needle module against deviation in a downward direction; a space forming means for obtaining a movement space of said mass ring, in which said means is placed above said guide ring; and a probe card PCB, on which a signal pattern is formed, formed on said space forming means, thereby protecting said upper fixing plate from movements in a lateral direction and to protect said needle module against deviations in an upper direction. The probe card can make smooth contacts between the pads formed on an upper portion of a semiconductor IC chip and the vertical-type needles and is also capable of testing a multiple of semiconductor IC chips simultaneously. |
