BARE CHIP CARRIER, BURN-IN DEVICE USING THE SAME, AND BARE CHIP BURN-IN METHOD

摘要

A bare chip carrier of thin construction in which a recyclable substrate is combined with a bonding method for wire bonding a bare chip to the substrate, and which has a high reliability, a low price and a good space factor. A bare chip carrier (2) is loaded on a burn-in board of a burn-in device. The pads (5) of a bare chip (4) and the bumps (7) of a substrate (6) are connected to one another through gold wires (8) by wire bonding, and the gold wires (8) can be cut off, making the substrate (6) recyclable. The bare chip carrier (2) has a multilayer structure such that a lower plate (9), a spacer (10), of which an opening houses therein the bare chip (4), the substrate (6) and an upper plate (11) are hermetically stacked with rubber sheets (12 to 14) therebetween, and are clamped by bolts (15), washers (16) and two nuts (17, 18). They can be disassembled and reassembled.