HOUSING FOR MICROELECTRONICS COMPONENTS AND MODULES AND PROCESS FOR PRODUCING IT

摘要

The invention concerns a high-temperature thermoplastics housing for microelectronics components and modules. The housing has a permanent operating temperature of at least 180 DEG C with an integral heat sink (3) and a lower housing (4). The component connections predominantly take the form of strips disposed on an insulating layer and are partially extrusion-coated with plastics material. The housing also comprises a cover (9) which can be connected to the lower housing (4) when the components have been introduced and their electrical connections have been established. The strip-shaped connections are part of a conductor frame (6), and an insulating layer (2) in the form of a rectangular frame is disposed between the heat sink (3), which consists of a sheet of material which is a good heat conductor, and the tongue-like connections (1) of the conductor frame (6). It is further provided that only part of the length of the tongue-like connections (1) is in contact with the insulating layer (2), terminates on the inside of the frame (2) and rests in an interlocking manner on this layer and the base (3) of the lower housing (4). The plastics material constituting the lower housing is a high-temperature thermoplastics with a processing temperature T > 300 DEG C. In order to bond the conductor frame (6) and the insulating layer (2), the former can be centred relative to the insulating layer (2) and connected thereto. The insulating layer (2) is dimensionally stable when the plastics material for the lower housing (4) is being processed.