Apparatus dissipating heat from an electronic circuit

摘要

The heat dissipation device has a releasable thermal bridge between a semiconductor chip and a heat sink, provided by a pair of interfitting brushes with bristles (7) of a thermally conductive material. The base (6) of one brush is in thermal contact with the semiconductor chip and the base (6) of the other brush is in thermal contact with the heat sink. Pref. the bristles of both brushes are provided by brass wires, with the bristles interengaging over at least part of their length.