| 摘要 |
<p>PURPOSE:To prevent the damage of a semiconductor chip and the attaching of dust by inserting a laminated body into a dust-proof box and carrying the body, which is constituted by stacking, via spacers, a plurality of retaining means wherein a semiconductor wafer subjected to full-cutting is stuck. CONSTITUTION:About ten sheets of wafer retaining means 1, wherein a semiconductor wafer 2 subjected to full-cutting is stuck, are laminated on the bottom plate 31 of a wafer lamination stand 3, by using a guiding member 32 as a guide and making spacers 4 interpose. This wafer lamination body 6 is inserted into a dust-proof box 7 and fixed by a spring 71. When the body 6 is carried to the next process in the above state, semiconductor chips are not damaged, and dust can be prevented from sticking on the chip surface.</p> |
