THIN FILM WIRING SHEET, MULTILAYER WIRING BOARD AND THEIR PRODUCTION

摘要

PROBLEM TO BE SOLVED: To enhance the connection reliability while eliminating the delamination, short circuit and open circuit. SOLUTION: An insulation film 11, a planar wiring 12, and via wirings 16, 18 having one end exposed to the surface of insulation film 11 and the other end connected with the planar wiring 12 are provided. The planar wiring 12 is buried in the insulation film 11. A recess for restricting the spreading of conductor connection material is provided around the exposed part of via wiring.