| 摘要 |
A non-impact printhead is formed of modules. Each module comprises a tile support that has mounted thereon a plurality of LED chip arrays and driver chip arrays for driving the LEDs. A spreader board is also mounted on the tile for distributing signals to the driver chips. A ground connection between the LEDs and the spreader board is made without relying upon electrical conductivity through the tile and a mother board which supports several tiles. Rather, a ground path is provided by a conductive layer upon the tile. In one embodiment, a via in the spreader board connects this ground path with the top surface of the spreader board. In a second embodiment, the ground path continues along a bottom surface of the spreader board to a ground strip of a bus bar.
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