发明名称 HEAT PUMP TYPE COOLING AND HEATING DEVICE
摘要 PROBLEM TO BE SOLVED: To obtain a heat pump type cooling and heating device capable of coping with any demand having a high thermal load. SOLUTION: This heat pump type cooling and heating device is so constituted that the heat medium of a heat transfer circuit can be heated not only by a thermal gas engine 1 but also by a heating means 55 indirectly through a heat exchanger 90 for heating. Accordingly, the cooling and heating device can cope with any demand having a high thermal load (quick heating and the like) which can not be coped with by only the thermal gas engine 1 and, further, the heat exchanger 90 for heating is not heated directly by a heating means but is heated indirectly through a heating medium and, therefore, the heat exchanger can not only be heated stably but also can increase the possibility of utilizing it for another use since the heat exchanger 90 for heating is equipped with utilizing heat exchangers 51, 53.
申请公布号 JPH0953846(A) 申请公布日期 1997.02.25
申请号 JP19950204601 申请日期 1995.08.10
申请人 SANYO ELECTRIC CO LTD 发明人 MATSUE JUNJI;KUROSAWA YOSHIAKI
分类号 F24F5/00;F24D3/18;F25B9/14;F25B29/00;F25B39/02;(IPC1-7):F24F5/00 主分类号 F24F5/00
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