| 摘要 |
<p>PROBLEM TO BE SOLVED: To make it possible to modify wiring patterns without removing once electronic components, which are already mounted to a multilayer board. SOLUTION: Grooves 3 are respectively formed in the outer peripheries of fixing parts 1a, which are respectively fixed with an electronic component 2, on a multilayer board 1. A plurality of conductor pads 4 are respectively provided on the bottoms of the grooves 3. The pads 4 and the components 2-and the pads 4 are connected with each other through bonding wire wirings 5 utilizing the pads 4 on the bottoms of the grooves 3, whereby wiring patterns are respectively formed of the wirings 5 in the grooves 3. Moreover, conductor pads 7 provided on the fixing parts 1a are connected with each other through bonding wire wirings 6, whereby the adjacent components 2 are connected with each other on the surface of the board 1. The wirings 5 buried in the grooves 3 can be made to intersect the wirings 6 wired on the surface of the board 1. Moreover, the wirings 5 formed in the grooves 3 can be also made to intersect each other in the spaces on the pads 4.</p> |
