发明名称 |
Electrically conductive bonding films |
摘要 |
Described is an electrically conductive bonding film useful in bonding an IC or LSI with a lead frame. The film comprises (A) a polyimide resin obtained by reacting a tetracarboxylic dianhydride component, in which the content of a tetracarboxylic dianhydride represented by the following formula (I): <IMAGE> (I) wherein n stands for an integer of 2-20 amounts to at least 70 mole %, with a diamine; (B) an electrically conductive filler, and a thermoset resin. Optionally, the film may further comprises a thermosetting resin or an imide compound having at least two thermally-crosslinking imido groups per molecule.
|
申请公布号 |
US5605763(A) |
申请公布日期 |
1997.02.25 |
申请号 |
US19950560182 |
申请日期 |
1995.11.20 |
申请人 |
HITACHI CHEMICAL COMPANY LTD. |
发明人 |
YUSA, MASAMI;TAKEDA, SHINJI;MASUKO, TAKASHI;MIYADERA, YASUO;YAMAZAKI, MITSUO |
分类号 |
C09J7/00;C08J5/18;C08K3/08;C08L79/08;C09J7/02;C09J161/06;C09J163/00;C09J179/08;H01B1/22;H01B5/14;H01L21/52;H05K3/38;(IPC1-7):B32B27/18;C90J7/00 |
主分类号 |
C09J7/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|