| 摘要 |
PROBLEM TO BE SOLVED: To eliminate a hardened layer for forming a rigid part by subjecting a copper foil entirely covering a coverlay formed by hardening a semihardened bonding sheet thereby making an opening. SOLUTION: Conductor circuits 12', 14 are hot-pressed while sandwiching a bonding sheet 21 to produce a coverlay 31. Similarly, conductor circuits 13', 15 are hot-pressed while sandwiching a bonding sheet 22 to produce a coverlay 32. Since a copper foil is removed from the outermost layer at the openings 14a, 15a, flexibility is imparted to provide a flex part F. The part other than the openings 14a, 15a is composed of a polyimide based resin sheet material 1, coverlays 31, 32 of epoxy resin containing no glass cloth, and conductor circuits 12', 13', 14', 15', a rigid part R is provided. This structure reduces the thickness and production cost of a rigid flex printed wiring board. |
