| 摘要 |
The resin-molded type semiconductor device disclosed has a semiconductor chip mounted on an island of a lead frame. The device includes a plurality of first metal foil leads on a tape carrier, which connect electrode pads respectively to inner leads of the lead frame. Among the first metal foil leads, there are a plurality of second metal foil leads which constitute ground wiring, and these second metal foil leads are connected in parallel to the island. For these connections, each of the second metal foil leads has one branch lead, or two branch leads respectively on the inner lead side and on the outer lead side. By forming the ground wiring in this way, it is possible to reduce the parasitic inductance and resistance of the ground circuit. |
