| 摘要 |
PROBLEM TO BE SOLVED: To prevent a short circuit between a chip and a lead when resin is molded by a method wherein a lead is wired toward inside direction of a polyimide tape from the junction part with a chip, and the lead is bent to vertical direction on the plane surface of the polyimide tape. SOLUTION: Leads 2 are wired toward the inside on a polyimide tape 3 from the connected place with a chip 1. As a result, the leads 2 are connected to the chip 1 on a bump 4 when the chip is installed, and the polyimide tape 3 is pinched between the leads 2 and the chip 1. The leads 2 are insulated from the chip l by the polyimide tape 3, and as the part between the leads 2 and the chip 1 is filled up, the downward movement of the leads 2 is suppressed even when external force is added to the leads 2, and the contact with the chip can be prevented. As a result, the rate of generation of defective products when the chip 1 ms mounted on a tape carrier package can be lowered, and the yield of production can be improved. |
