| 摘要 |
FIELD: heat engineering; removal of heat from thermally stressed objects; removal of heat from heat release sources having flat contact surface, powerful semiconductor thyristors in particular. SUBSTANCE: evaporating chamber is made in form of flat disk. It has housing with lateral wall 1 and steam header 2 and two end walls 3 and 4. Steam line 5 of loop thermal tube is connected to first steam header. Capillary porous packing 6 located inside housing adjoins lateral wall 1 over part of its length and end wall 3. Inner surface of end wall 3 has circular concentric grooves 7 and surface of packing 6 adjoining it has longitudinal bores 8 which form single system of steam-discharge passages communicating with steam header 2. Inner surface of end wall 3 and surface of packing 6 adjoining it form first thermocontact surface. Clearance 9 formed between packing 6 and end wall 4 is used for accumulation of working fluid and is brought in communication with condensate line 10. Evaporating chamber may be provided with additional macroporous packing 11 located in clearance 9 and kept in contact with first packing 6. End wall 3 of chamber may be made in form of flange with fastening holes 12. Evaporating chamber may be provided with central through passage 13. Evaporating chamber may be provided with second thermocontact surface which is symmetrical relative to first one and is formed by second packing 16, second end wall 4 and system of steam discharge passages including grooves 15 and bores 17 communicating with second header 18. Clearance 19 formed between first and second packings is used for accumulation of working fluid. Evaporating chamber may be provided with additional steam header 20 located along central axis of packing. In this case, thermocontact surface of packing has radial bores 21 communicating both with first and additional steam headers and radial bores 22 communicating with first steam header. EFFECT: enhanced efficiency. 6 cl, 9 dwg |
