HYDRAULIC PRESS FOR ENCAPSULATING SEMICONDUCTOR COMPONENTS

摘要

The proposal is for a hydraulic press for encapsulating semiconductor components in which the injection plungers (S1 to S4) in a tool are connected to the pressure chambers (DZ) of displacement-controlled intermediate pistons (Z1 to Z4) via hydraulic lines (L1 to L4). The intermediate pistons are actuated by a common drive piston (A1) which is pressure and displacement-controlled.