发明名称 Soldering of conductor paths of flexible printed circuit to respective mounting surfaces
摘要 The connecting faces of a circuit board are soldered to conductive paths of a flexible printed circuit by a process in which the coupling ends of the conductive tracks are pressed in the coupling region by a soldering tool for connection by soldering. The circuit board has heat-inducing faces formed on the obverse side, away from the connecting faces, in a mirror image configuration to the latter. The heat-inducing faces are coupled to the connecting faces via galvanically formed, electrically conductive, heat conductive sleeves, with soldering heat provided mostly fro the obverse side, and only fractionally by the flexible printed circuit.
申请公布号 DE19530353(A1) 申请公布日期 1997.02.20
申请号 DE19951030353 申请日期 1995.08.18
申请人 VDO ADOLF SCHINDLING AG, 60326 FRANKFURT, DE 发明人 BUCK, RAYMOND, DR., 61350 BAD HOMBURG, DE;FRIEPES, GERHARD, 61231 BAD NAUHEIM, DE;MEISEL, MATHIAS, 60388 FRANKFURT, DE;KOENIG, EBERHARD, 61138 NIEDERDORFELDEN, DE
分类号 H05K1/02;H05K3/34;H05K3/36;(IPC1-7):H05K3/34 主分类号 H05K1/02
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