| 发明名称 |
REDUCED ELECTROMIGRATION INTERCONNECTION LINE |
| 摘要 |
<p>The electromigration lifetime of a metal interconnection line is increased by adjusting the length of the interconnection line, or providing longitudinally spaced apart holes or vias, to optimize the Backflow Potential Capacity of the metal interconnection line.</p> |
| 申请公布号 |
WO9706561(A1) |
申请公布日期 |
1997.02.20 |
| 申请号 |
WO1996US12534 |
申请日期 |
1996.07.31 |
| 申请人 |
ADVANCED MICRO DEVICES, INC. |
发明人 |
BUI, NGUYEN, DUC;WOLLESEN, DONALD, L. |
| 分类号 |
H01L23/528;H01L23/532;(IPC1-7):H01L23/532 |
主分类号 |
H01L23/528 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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