Wiring clamp apparatus for connecting semiconductor chip to carrier wiring

摘要

The apparatus (1) includes two flat jaws (2,3) which are moveable w.r.t. one another to clamp and move or hold wiring (12), esp. bonding wiring of different diameters. The two jaws are connected with one another via a guide. The clamp is associated with a bonding device and the bonding wiring is secured to bonding surfaces with the help of the bonding device. One of the jaw surfaces (4) is adjustable opposite the bonding wire and the jaw itself (2) is connected with the bonding device. The surface (5) of the other jaw (3) is parallel to the surface of the initial jaw and the two surfaces are movable parallel to one another.