SUBSTRATE POLISHING DEVICE

摘要

PROBLEM TO BE SOLVED: To improve the in-plane uniformity of the polishing rate of a substrate polishing device when the device polishes a substrate. SOLUTION: A substrate polishing device polishes a substrate 6 held by a polishing head 4 by suction through a substrate suction pad 5 by pressing the substrate 6 against a polishing pad 2 stuck to a polishing plate 1. The sinking margin A of the pad 5 is adjusted so that the margin A can become lower than the that A of the pad 2 in a prescribed pressurizing state.