Scalable test interface port

摘要

An apparatus for electrically connecting electrical contact pads on a first circuit board to electrical contact pads on a second circuit board is disclosed. Conductive bumps coupled to signal wires on a support element mate with the electrical contact pads on the first and second circuit boards. The mating provides an electrical connection allowing signals to be transmitted between the circuit boards. Alignment holes and alignment circuitry provide a means for verifying that the proper conductive bumps are mating with the proper electrical contact pads.