| 发明名称 |
Apparatus, and corresponding method, for stress testing semiconductor chips |
| 摘要 |
An apparatus, and a corresponding method, for stress testing both wire bond-type semiconductor chips and C4-type semiconductor chips is disclosed.
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| 申请公布号 |
US5604445(A) |
申请公布日期 |
1997.02.18 |
| 申请号 |
US19940360919 |
申请日期 |
1994.12.21 |
| 申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
DESAI, KISHOR V.;PATEL, MAGANLAL S.;SATHE, SANJEEV |
| 分类号 |
G01R1/04;G01R31/28;H01R4/58;(IPC1-7):H05K5/00;H01R9/09 |
主分类号 |
G01R1/04 |
| 代理机构 |
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代理人 |
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| 主权项 |
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