发明名称 COOLING MEDIUM SUPPLY DEVICE OF EXTRUSION MOLDING DEVICE
摘要 <p>PROBLEM TO BE SOLVED: To uniformly eject a cooling medium and, locally adjust the amount of ejected air in the peripheral direction, and mold a resin into a film of a uniform thickness without the uneven distribution of the resin throughout the film. SOLUTION: Diaphragm members 22 for directing a cooling medium to a central direction are arranged at a specified interval in the peripheral direction between nozzle plates 17, 19 which form a communication path for the cooling medium to be ejected to the outer periphery of an ejected resin. In addition, a pipe 23 for feeding/suction of the cooling medium which feeds the cooling medium to an area between the diaphragm members 22 sucks the cooling medium from an area between the diaphragm members, in accordance with the film thickness of the ejected resin, is arranged.</p>
申请公布号 JPH0948058(A) 申请公布日期 1997.02.18
申请号 JP19960134945 申请日期 1996.05.29
申请人 TOMY KIKAI KOGYO KK 发明人 NIIMOTO SANEMI;KATSUMOTO HIROYUKI
分类号 B29C47/14;B29C47/20;B29C47/76;B29C47/88;B29C47/92;B29C55/28;B29L7/00;(IPC1-7):B29C47/88 主分类号 B29C47/14
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