| 摘要 |
<p>PROBLEM TO BE SOLVED: To enhance the mechanical strength of an IC card by using a sheetlike hot-melt adhesive to stick an IC module to the first recess, and using liquiddlike adhesive to stuck the IC module to the unused area of the first recess and the IC module to the second recess. SOLUTION: Sheetlike hot-melt adhesive 4 of substantially the same shape as that of the first recess is mounted in the first recess of an embedded part 1, and liquidlike adhesive 5 is mounted in the second recess. An IC module 3 is embedded in the part 1, and stuck by a predetermined hot pressing. More particularly, after the adhesives are provided at the part 1 of a card base material 2 by using the adhesives 4, 5, the module 3 is positioned at the part 1, embedded, a heat block is pressed in contact with the contact surface of the module 3 to be hot pressed, the hot-melt adhesive is melted, and then when the block is released, the module 3 is stuck to the material 2.</p> |
