| 摘要 |
The probe apparatus for a semiconductor wafer has a work table on which a wafer is placed. A printed wiring board having a high rigidity is situated above the work table. A flexible membrane probe card is detachably mounted on the printed wiring board. The probe card has a main region in which contact elements to be brought into contact with electrode pads of the semiconductor wafer are arranged. A rigid rectangular frame is attached to the rear surface of the probe card so as to flatten the probe card. An expandable chamber for bringing the contact elements of the main region into elastic contact with the electrode pads of the semiconductor wafer, is provided behind the main region of the probe card. A guide is arranged to surround the expandable chamber in tight contact therewith. A pushing plate having a hard base and elastic layers is arranged between the expandable chamber and the probe card. The main region is pushed out by the pushing plate in a state parallel to the wafer.
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