| 摘要 |
A method for producing relief surface structures comprises the step of providing a photoresist layer having a relief surface structure on a surface of a substrate, the relief structure of the photoresist layer being like the surface relief structure desired on the substrate, then removing the photoresist layer with an erosion process that erodes both the photoresist layer as well as the substrate material which is free of the photoresist layer or becomes free of the photoresist layer. To obtain the relief surface structure in the photoresist layer, the layer can be exposed with different amounts of exposure and then developed to form the relief structure
|
