RESIN SEALING OF IC MODULE, IC MODULE, AND IC CARD

摘要

PROBLEM TO BE SOLVED: To realize low cost production facilities with the small space thereof by coating the chip surface with a thermo-setting resin, thereafter covering the theremosetting resin with an ultraviolet-setting resin and then hardening this resin and thereafter perfectly hardening the thermosetting resin. SOLUTION: An IC chip 3 is connected by wire bonding to a printed wiring substrate 2 having a contact surface 8, the IC chip 3 is covered first with a resin sealing section 5 of the thermo-setting resin and thereafter the IC chip 3 is further covered with a resin sealing section 6 of ultraviolet-setting resin to provide the double-covering structure. In the primary hardening process, the ultraviolet-setting resin is hardened and the thermo-setting resin is perfectly hardened by the post-hardening process. Since the ultraviolet-setting resin is perfectly hardened only with the irradiation of short period of ultraviolet ray, duration of the primary hardening process can be shortened. Thereby, facilities can be simplified and cost can also be reduced.